JSW Vacuum Laminator MVLP-3ST-αX 

​Product Use

UF bonding of TSV wafers, insulation layer of PCB forming the shield layer of flexible substrates, rigid bonding boards, PCBs, openings, and loops forming touch panels, forming circuits of various electrical appliances, and thermal transcription of insulating materials and sealing materials of electronic parts to fit optics and subtle patterns.

1.High production efficiency achieved by shortening the transportation distance.

2.No need to restrict the pressing force to improve filling performance; position control function enhances thickness uniformity.

3.Suppress the resin overflow amount.

4.Flat lamination (2ND/3RD) without relying on buffering effects.

5.Space-saving design, occupying only 77% of the installation area of competitors' products.

6.Roller unit and substrate receiving unit for easy operation.

7.Electrical components such as vacuum pumps are all housed inside the equipment.

8.Fully electric servo lamination for precise control.