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JSW hot press
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JSW HOT press 

Product Use

It is used for the molding of multi-layer printed wiring boards, CCL/other HP plywood and decorative boards, etc. You can choose between a temperature of 260 ℃ and a high temperature of 40 ℃.

Product advantages

  1. Due to the use of a floating device to support the load tray during loading, there is no direct contact between the product and the hot plate, and no damage will occur. (Can maintain the accuracy of the hot plate)
  2. The dual circuit design of the hot plate can more accurately control the temperature uniformity of the hot plate, ensuring the uniformity of product thickness and saving 30% energy. At 180 ℃, the single-layer temperature deviation is about 2.0 ℃ or less
  3. High flatness hot plate thickness accuracy: range of 20um
  4. Servo cylinder control: energy-saving by 1/8.
  • Brand & Channel Advantage Brand & Channel Advantage Authorized Level‑1 Agent of JSW, strategic cooperation with multiple imported instrument brands
  • R&D & Production Advantage R&D & Production Advantage In‑house production equipment, independent hardware & software R& D
  • Industry Solution Advantage Industry Solution Advantage Deep‑rooted in PCB & semiconductor industry, one‑stop full‑line supporting solutions
  • Global Service Advantage Global Service Advantage Domestic and overseas service outlets, prompt technical after‑sales support