Everyone is searching.: PCB Equipment 、 IC Substrate Equipment 、 JSW Vacuum Laminator 、 Vacuum Leveling Machine
JSW Nippon Steel/MEIKI vacuum laminating machine MVLP α 500/600v

This device has:
Vacuum pressurization, flat pressing, high temperature uniformity, long service life, using soft airbags and silicone pads for pressurization,
For products with large surface differences, the soft characteristics of airbags can be utilized for good filling during film pressing, which can reduce the residual bubbles at the corners of the differences,
Reduce the occurrence of side etching or plating phenomenon during development etching.