The products are widely used in IC substrates, glass substrates, semiconductors and other industries, and the surface flatness of the products can reach a higher level through vacuum and flattening

1. Four languages are available: Japanese, English, Chinese, and Korean

2. Through segmented precision processes, continuous automated operations, and the synergy of carrier films, we enhance production efficiency while strengthening control over product quality.

3. The hot-pressing leveling steel plate features a mirror-finish surface. For its flatness, the test shows a maximum deviation of ≤10μm. For substrates with a thickness of 0.1mm–0.6mm and a step difference of 18μm, when the dry film ink thickness is 30μm, the ink thickness variation remains ≤5μm.

4. High-precision embeddability and high-precision flatness.