The peel strength tester independently developed by Cijin,

Mainly used in the copper-clad laminates and printed circuit board industry to measure the peel strength of copper foil on rigid and flexible boards under normal and thermal shock conditions,

The device adopts a universal design pattern for both soft and hard boards,

The fixture can be replaced by oneself,

Switching measurement requirements between hard and soft boards

The guide rails and sliders in the fixture are all made of silver brand products,

Characterized by low resistance and high precision

The device is designed with a speed regulator and a speed display,

According to the IPC standard requirements,

Accurately adjust the peeling speed

At the same time, the force measurement results can be intuitively read on the tension gauge, or displayed with graphics and text in conjunction with software.